cystech electronics corp. spec. no. : c485e2 issued date : 2011.03.28 revised date : 2011.03.29 page no. : 1/4 MSR2560E2 cystek product specification 25amp. superfast high voltage rectifiers MSR2560E2 features ? 175 operating junction temperature ? low leakage current ? superfast recovery time i f(av) 25a v rrm 600v i fsm 150a trr 30ns tj 175 c v f(max) 2.5v ? low switching loss, high efficiency ? high forward surge capability ? high temperature soldering guaranteed : 260 /40s, 0.25?(6.35mm) from case ? pb-free lead plating package mechanical data ? case: to-220ac molded plastic ? mounting position: any ? weight: 1.85 grams, 0.065 ounce approximately ? terminals: pure tin plated, sold erable per j-std-002 and jesd22-b102 ? epoxy: ul 94v-0 rate flame retardant ? polarity : as marked. equivalent circuit outline to-220ac MSR2560E2 k a
cystech electronics corp. spec. no. : c485e2 issued date : 2011.03.28 revised date : 2011.03.29 page no. : 2/4 MSR2560E2 cystek product specification maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol min. typ. max. units maximum recurrent peak reverse voltage v rrm 600 v maximum rms voltage v rms 420 v maximum dc blocking voltage v dc 600 v t c =25 c 1.8 2.5 maximum instantaneous forward voltage at i f =25a t c =125 c v f 1.6 2.0 v maximum average forward rectified current @ t c =140 i f(av) 25 a non-repetitive peak forward surge current @ 8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 150 a v r =600 v, t c =25 10 maximum instantaneous reverse current at v r =600 v, t c =125 i r 500 a maximum reverse recovery time i f =1a, v r =30v, di f /dt=100a/ s trr 30 ns typical junction capacitance @ f=1mhz and applied 4v reverse voltage c j 210 pf storage temperature range t stg -65 +175 operating junction temperature range t j -65 +175 thermal data parameter symbol value unit maximum thermal resistance, junction-to-case r th,j-c 1.4 c/w maximum thermal resistance, junction-to-ambient r th,j-a 62.5 c/w ordering information device package shipping MSR2560E2 to-220ac (rohs compliant package) 50 pcs / tube, 40 tubes/box
cystech electronics corp. spec. no. : c485e2 issued date : 2011.03.28 revised date : 2011.03.29 page no. : 3/4 MSR2560E2 cystek product specification typical characteristics forward current derating curve 0 5 10 15 20 25 30 0 25 50 75 100 125 150 175 200 case temperature---t c () average forward current---io(a) resistive or inductive load forward current vs forward voltage 1 10 100 1000 10000 100000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle tj=25 tj=150 tj=75c tj=125c reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 1000 0 100 200 300 400 500 600 reverse voltage---v r (v) reverse leakage current---i r (a) tj=75 tj=25 tj=125 tj=150c junction capacitance vs reverse voltage 10 100 1000 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz
cystech electronics corp. spec. no. : c485e2 issued date : 2011.03.28 revised date : 2011.03.29 page no. : 4/4 MSR2560E2 cystek product specification to-220ac dimension millimeters inches millimeters inches dim min. marking: k a style: pin 1, 2, 4 cathode 3.anode 2-lead to-220ac plastic package cystek package code: e2 device name date code msr 2560 cys min. max. dim min. max. min. max. max. a 4.470 4.670 0.176 0.184 e 2.540 typ 0.100 typ a1 2.520 2.820 0.099 0.111 e1 4.980 5.180 0.196 0.204 b 0.710 0.910 0.028 0.036 f 2.590 2.890 0.102 0.114 b1 1.170 1.370 0.046 0.054 h 0.000 0.300 0.000 0.012 c 0.310 0.530 0.012 0.021 l 13.400 13.800 0.528 0.543 c1 1.170 1.370 0.046 0.054 l1 3.560 3.960 0.140 0.156 d 10.010 10.310 0.394 0.406 l2 0.000 1.000 0.000 0.039 e 8.500 8.900 0.335 0.350 3.735 3.935 0.147 0.155 e1 12.060 12.460 0.475 0.491 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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